For those of you doing pools and spas
Change Affecting Pools and Spas
All pool permit applications submitted on or after April 2, 2007 will be subjected to requirements found in the most current adopted edition of the National Electrical Code (NEC) and the Florida Building Code.
The current edition of the NEC Article 680.26C, requires a 3-foot wide Equipotential Bonding Grid to connect all metallic structural components, underwater lighting, metal fittings, electrical equipment and other metal wiring and equipment. The bonding grid shall extend 3-feet horizontally from, and around the perimeter of swimming pools and spas bonded at all points.
In addition to other requirements for pool permits, the plan must show the extent of pool decking material as well as the material for the deck. Reference Inspection Process items 1-5 below.
Permit applicants must acknowledge on their plans, compliance with the 3 feet wide Equipotential Common Bonding Grid. In doing so, they must indicate the method of bonding as either; 1) The structural re-enforcing steel of the pool extended horizontally at the deck level, or 2) Bolted or welded metal pool walls located above grades, or 3) Other Alternate means which may include:
• A #8AWG solid copper field fabricated equipotential bonding grid system. Each section of grid must be clamped with listed devices and/or #8AWG solid copper jumper, or
• A 12x12x #8AWG solid copper welded grid (copper bonding mat). Each section of grid must be clamped with listed devices and/or #8AWG solid copper jumper.
• A 6x6x10WWF (Welded Wire Fabric) bonding grid set atop chairs. Each section of grid must be clamped with listed devices and/or #8AWG solid copper jumper.
This bonding grid is considered a function of the installation or construction of the pool. Therefore it is not acceptable for the permit applicant to simply indicate the deck will be done by others.
If the deck is indicated as done by others, the primary pool contractor must still provide the equipotential bonding grid to set the deck onto.