Swimming pool bonding question

[rsole (Robert Sole, CMI)]

I understand that all metal parts of the pool are required to be bonded. My question is does the bond wire have to be connected to the pool timer? At my home the timer is in an electronic controller and the controller has a bonding lug on it so I connected it. Last inspection I did had bond wires to the pump, screen and shell but it was not connected to the timer. Should it be?

[rmeier2 (Robert Meier)]

Here’s the whole NEC section. Take a look at (B)(6).

680.26 Equipotential Bonding.
(A) Performance. The equipotential bonding required by this section shall be installed to reduce voltage gradients in the pool area.

(B) Bonded Parts. The parts specified in 680.26(B)(1) through (B)(7) shall be bonded together using solid copper conductors, insulated covered, or bare, not smaller than 8 AWG or with rigid metal conduit of brass or other identified corrosion-resistant metal. Connections to bonded parts shall be made in accordance with 250.8. An 8 AWG or larger solid copper bonding conductor provided to reduce voltage gradients in the pool area shall not be required to be extended or attached to remote panelboards, service equipment, or electrodes.
(1) Conductive Pool Shells. Bonding to conductive pool shells shall be provided as specified in 680.26(B)(1)(a) or (B)(1)(b). Poured concrete, pneumatically applied or sprayed concrete, and concrete block with painted or plastered coatings shall all be considered conductive materials due to water permeability and porosity. Vinyl liners and fiberglass composite shells shall be considered to be nonconductive materials.
(a) Structural Reinforcing Steel. Unencapsulated structural reinforcing steel shall be bonded together by steel tie wires or the equivalent. Where structural reinforcing steel is encapsulated in a nonconductive compound, a copper conductor grid shall be installed in accordance with 680.26(B)(1)(b).
(b) Copper Conductor Grid. A copper conductor grid shall be provided and shall comply with (b)(1) through (b)(4).
(1) Be constructed of minimum 8 AWG bare solid copper conductors bonded to each other at all points of crossing
(2) Conform to the contour of the pool and the pool deck
(3) Be arranged in a 300-mm (12-in.) by 300-mm (12-in.) network of conductors in a uniformly spaced perpendicular grid pattern with a tolerance of 100 mm (4 in.)
(4) Be secured within or under the pool no more than 150 mm (6 in.) from the outer contour of the pool shell
(2) Perimeter Surfaces. The perimeter surface shall extend for 1 m (3 ft) horizontally beyond the inside walls of the pool and shall include unpaved surfaces as well as poured concrete and other types of paving. Bonding to perimeter surfaces shall be provided as specified in 680.26(B)(2)(a) or (2)(b) and shall be attached to the pool reinforcing steel or copper conductor grid at a minimum of four (4) points uniformly spaced around the perimeter of the pool. For nonconductive pool shells, bonding at four points shall not be required.
(a) Structural Reinforcing Steel. Structural reinforcing steel shall be bonded in accordance with 680.26(B)(1)(a).
(b) Alternate Means. Where structural reinforcing steel is not available or is encapsulated in a nonconductive compound, a copper conductor(s) shall be utilized where the following requirements are met:
(1) At least one minimum 8 AWG bare solid copper conductor shall be provided.
(2) The conductors shall follow the contour of the perimeter surface.
(3) Only listed splices shall be permitted.
(4) The required conductor shall be 450 to 600 mm (18 to 24 in.) from the inside walls of the pool.
(5) The required conductor shall be secured within or under the perimeter surface 100 mm to 150 mm (4 in. to 6 in.) below the subgrade.
(3) Metallic Components. All metallic parts of the pool structure, including reinforcing metal not addressed in 680.26(B)(1)(a), shall be bonded. Where reinforcing steel is encapsulated with a nonconductive compound, the reinforcing steel shall not be required to be bonded.
(4) Underwater Lighting. All metal forming shells and mounting brackets of no-niche luminaires shall be bonded.
Exception: Listed low-voltage lighting systems with nonmetallic forming shells shall not require bonding.
(5) Metal Fittings. All metal fittings within or attached to the pool structure shall be bonded. Isolated parts that are not over 100 mm (4 in.) in any dimension and do not penetrate into the pool structure more than 25 mm (1 in.) shall not require bonding.
(6) Electrical Equipment. Metal parts of electrical equipment associated with the pool water circulating system, including pump motors and metal parts of equipment associated with pool covers, including electric motors, shall be bonded.
Exception: Metal parts of listed equipment incorporating an approved system of double insulation shall not be bonded.
(a) Double-Insulated Water Pump Motors. Where a double-insulated water pump motor is installed under the provisions of this rule, a solid 8 AWG copper conductor of sufficient length to make a bonding connection to a replacement motor shall be extended from the bonding grid to an accessible point in the vicinity of the pool pump motor. Where there is no connection between the swimming pool bonding grid and the equipment grounding system for the premises, this bonding conductor shall be connected to the equipment grounding conductor of the motor circuit.
(b) Pool Water Heaters. For pool water heaters rated at more than 50 amperes and having specific instructions regarding bonding and grounding, only those parts designated to be bonded shall be bonded and only those parts designated to be grounded shall be grounded.
(7) Metal Wiring Methods and Equipment. Metal-sheathed cables and raceways, metal piping, and all fixed metal parts shall be bonded.
Exception No. 1: Those separated from the pool by a permanent barrier shall not be required to be bonded.
Exception No. 2: Those greater than 1.5 m (5 ft) horizontally of the inside walls of the pool shall not be required to be bonded.
Exception No. 3: Those greater than 3.7 m (12 ft) measured vertically above the maximum water level of the pool, or as measured vertically above any observation stands, towers, or platforms, or any diving structures, shall not be required to be bonded.
(C) Pool Water. An intentional bond of a minimum conductive surface area of 5806 mm2 (9 in.2) shall be installed in contact with the pool water. This bond shall be permitted to consist of parts that are required to be bonded in 680.26(B).

[rsole (Robert Sole, CMI)]

Thank you for the response. I do not want to appear dense but I am reading that 2 ways. First that the metal on the timer should be connected. and second that it actually applies to the pump motor.

Also under Exception A, it seems to say that the bonding wire should be connected to the equipment ground.

Am I reading it entirely wrong.

[pcampbell (Pete Campbell)]

I have never seen a pool timer bonded in Port St. Lucie, FL

[mauger (Mike Auger, CMI - RI 43685, RMC-142, RMB-096)]

If the timer is plugged in to a grounded outelt (GFI protected) wouldne the ground in the circuit be sufficient? I’ve seen loads of pools actually bonded to ground, but never an additional line for timer.

[Billy_D.Drake]

Yeah the timer wire should bounded with the poolin the ground because I also never see any separate wire… could you show the photo?

[llosciale (Lawrence Losciale, HI 83, CBC022116, CPC0573)]

The timer BOX needs to be bonded only if it is metal most out there for the last 8 years have been in plastic boxes. And all of the metal parts need to be connected on the same bonding loop.

[llosciale (Lawrence Losciale, HI 83, CBC022116, CPC0573)]

Robert,
also note that in Florida we do not need a bonding grid of 12 x 12 copper in/under the deck. we are allowed by the FBC to use a single solid copper conductor in a “ring” or loop around the pool, no more than 18" from the waters edge and 4" to 6" below sub grade.

[pabernathy (Paul Abernathy, CMI®, CMECP® Electrical Code Academy,Inc.)]

If this timer is installed and associated with the pool water circulation system the i believe you know the answer…it needs to be connected to the equipotential bonding system. Lets remember that we are talking about the EBG (equipotential bonding grid) and that has nothing to do with equipment grounding conductors and the like. Let’s remember to keep the two issues separate…